apr . 20 1 5 . ver . 1.0 magnachip semiconductor ltd . 1 m dv1545s C s ingle n - channel trench mosfet 30 v absolute maximum ratings (ta = 25 o c) characteristics symbol rating unit drain - source voltage v dss 30 v gate - source voltage v gss 12 v continuous drain current (1) t c =25 o c (silicon limited) i d 41 a t c =25 o c (package limited) 32 t c = 70 o c (silicon limited) 33 t a =25 o c 1 5 t a = 70 o c 1 2 pulsed drain current i dm 120 power dissipation t c =25 o c p d 25.5 w t c = 70 o c 16 .3 t a =25 o c 3.5 t a = 70 o c 2.2 single pulse avalanche energy ( 2 ) e as 1 3 mj junction and storage temperature range t j , t stg - 55~150 o c thermal characteristics characteristics symbol rating unit thermal resistance, junction - to - ambient (1) r ja 36 o c/w thermal resistance, junction - to - case r jc 4.9 md v1545s sing le n - channel trench mosfet 30 v features ? v ds = 30 v ? i d = 32 a @v gs = 10v ? r ds(on) < 10.7 m @v gs = 10v < 13.0 m @v gs = 4.5 v ? 100% uil tested ? 100% rg tested general description the md v1545s uses advanced magnachip s mosfet technology, which provides high performance in on - state resistance, fast switching performance and excellent quality . md v1545s is suitable device for dc/dc converter and general purpose applications. s s s g g s s s d d d d d d d d p dfn 33 d g s
apr . 20 1 5 . ver . 1.0 magnachip semiconductor ltd . 2 m dv1545s C s ingle n - channel trench mosfet 30 v ordering information part number temp. range package packing ro hs status md v154 5s u rh - 55~150 o c p dfn 33 tape & reel halogen free electrical characteristics (t j =25 o c) characteristics symbol test condition min typ . max unit static characteristics drain - source breakdown voltage bv dss i d = 1m a, v gs = 0v 30 - - v gate threshold voltage v gs(th) v ds = v gs , i d = 250 a 1. 0 1. 5 2 . 0 drain cut - off current i dss v ds = 30 v, v gs = 0v - - 0.5 m a gate leakage current i gss v gs = 12 v, v ds = 0v - - 100 na drain - source on resistance r ds(on) v gs = 10v, i d = 13 a - 6.6 10.7 m t j = 125 o c - 8.9 13.9 v gs = 4.5 v, i d = 11 a - 8.0 13.0 forward transconductance g fs v ds = 5v, i d = 13 a - 49 - s dynamic characteristics total gate charge q g( 10 v) v dd = 15 v, i d = 13 a, v gs = 10v 17.4 24.9 32.4 nc total gate charge q g( 4.5 v) 7.1 10.2 13.2 gate - source charge q gs - 3.8 - gate - drain charge q gd - 3.6 - input capacitance c iss v ds = 15 v, v gs = 0v, f = 1.0mhz 1220 1445 1877 pf reverse transfer capacitance c rss 42 55 71.5 output capacitance c oss 284 370 480 turn - on delay time t d(on) v gs = 1 0 v, v d d = 1 5 .0v, i d = 13a, r g = 3 , - 12.2 - ns rise time t r - 5.6 - turn - off delay time t d(off) - 41.8 - fall time t f - 4.2 - gate resistance r g f=1 mhz - 1.0 2.0 drain - source body diode characteristics source - drain diode forward voltage v sd i s = 1a, v gs = 0v - 0. 45 1. 0 v body diode reverse recovery time t rr i f = 13 a, dl/dt = 100 a/s - 29.0 43.5 ns body diode reverse recovery charge q rr - 21.9 32.8 nc note : 1. surface mounted fr - 4 board by jedec (jesd51 - 7). continuous current at t c =25 is silicon limited 2. e as is tested at starting t j = 25 , l = 0.1 mh, i as = 15 a , v dd = 27v, v gs = 10v
apr . 20 1 5 . ver . 1.0 magnachip semiconductor ltd . 3 m dv1545s C s ingle n - channel trench mosfet 30 v fig.5 transfer characteristics fig.1 on - region characteristics fig.2 on - resistance variation with drain current and gate voltage fig.3 on - resistance variation with temperature fig.4 on - resistance variation with gate to source voltage fig.6 body diode forward voltage variation wi th source current and temperature -50 -25 0 25 50 75 100 125 150 0.6 0.8 1.0 1.2 1.4 1.6 1.8 notes : 1. v gs = 10 v 2. i d = 13 a r ds(on) , (normalized) drain-source on-resistance t j , junction temperature [ o c] 0 1 2 3 4 5 0 10 20 30 40 50 4.5v 3.5v 2.5v 3.0v v gs = 10v i d , drain current [a] v ds , drain-source voltage [v] 0 5 10 15 20 25 30 35 40 45 50 2 4 6 8 10 v gs = 10v v gs = 4.5v drain-source on-resistance [m ? ] i d , drain current [a] 2 3 4 5 6 7 8 9 10 0 5 10 15 20 25 30 notes : i d = 13.0a r ds(on) [m ], drain-source on-resistance v gs , gate to source volatge [v] 0 1 2 3 4 5 0 5 10 15 20 25 30 v gs , gate-source voltage [v] notes : v ds = 5v i d , drain current [a] 0.0 0.5 1.0 1.5 10 20 30 40 50 notes : v gs = 0v i dr , reverse drain current [a] v sd , source-drain voltage [v]
apr . 20 1 5 . ver . 1.0 magnachip semiconductor ltd . 4 m dv1545s C s ingle n - channel trench mosfet 30 v fig.7 gate charge characteristics fig.8 capacitance characteristics fig.9 maximum safe operating area fig.10 maximum drain current v s. case temperature fig.11 transient thermal response curve 10 -4 10 -3 10 -2 10 -1 10 0 10 1 10 2 10 3 10 -3 10 -2 10 -1 10 0 10 1 notes : duty factor, d=t 1 /t 2 peak t j = p dm * z jc * r jc (t) + t c single pulse d=0.5 0.02 0.2 0.05 0.1 0.01 z jc (t), thermal response t 1 , rectangular pulse duration [sec] 0 5 10 15 20 25 0 2 4 6 8 10 v ds = 15v note : i d = 13a v gs , gate-source voltage [v] q g , total gate charge [nc] 25 50 75 100 125 150 0 10 20 30 40 50 limited by package i d , drain current [a] t c , case temperature [ ] 10 -1 10 0 10 1 10 2 10 -1 10 0 10 1 10 2 10 3 1 ms 10 s 1 s 100 ms dc 10 ms operation in this area is limited by r ds(on) single pulse t j =max rated t c =25 i d , drain current [a] v ds , drain-source voltage [v] 0 5 10 15 20 25 30 0 400 800 1200 1600 2000 c iss = c gs + c gd (c ds = shorted) c oss = c ds + c gd c rss = c gd notes ; 1. v gs = 0 v 2. f = 1 mhz c rss c oss c iss capacitance [pf] v ds , drain-source voltage [v]
apr . 20 1 5 . ver . 1.0 magnachip semiconductor ltd . 5 m dv1545s C s ingle n - channel trench mosfet 30 v package dimension p dfn33 (3.3x3.3mm 2 ) d imensions are in millimeters, unless otherwise specified (unit: mm)
apr . 20 1 5 . ver . 1.0 magnachip semiconductor ltd . 6 m dv1545s C s ingle n - channel trench mosfet 30 v disclaimer: the products are not designed for use in hostile environments, including, without limitation, aircraft, nuclear power generation, medical appliances, and devices or systems in which malfunction of any product can reasonably be expected to result in a personal injury. sellers customers using or selling sellers products for use in such applications do so at their own risk and agree to fully defend and indemnify seller. magnachip reserves the right to change the specifications and circuitry without notice at any time. magnachip does not consider respons ibility for use of any circuitry other than circuitry entirely included in a magnachip product. is a registered tradema rk of magnachip semiconductor ltd.
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